A terminal connection comprises an HF conductor and a terminal apparatus. The terminal apparatus comprises an HF conductor receiving element comprising an HF conductor receiving hole. At least one solder deposit is arranged between the HF conductor and the HF conductor receiving element of the terminal apparatus to establish an electrically conductive connection. There is also an insertion sleeve comprising a receiving opening into which the HF conductor is inserted. The insertion sleeve is inserted into the HF conductor receiving hole in the HF conductor receiving element via an insertion opening on the plug-in side. The insertion sleeve is undeformable and/or is formed from a dielectric. It may also be adapted, in terms of the circumferential lateral face thereof, to an inner face of the HF conductor receiving hole. It may also comprise a receiving channel, which is used for receiving the at least one solder deposit.