Invention Grant
- Patent Title: High speed connector array
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Application No.: US15274441Application Date: 2016-09-23
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Publication No.: US09780497B1Publication Date: 2017-10-03
- Inventor: James M. Jeon , Mahmoud R. Amini , David H. Narajowski , Ruihua Ding , Christopher J. Stringer , Matthew P. Casebolt
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R13/658
- IPC: H01R13/658 ; H01R13/659 ; H01R12/91 ; H01R13/631 ; H01R13/518 ; H01R13/646

Abstract:
Combined connector receptacles, examples of which comprise tongues configured to be aligned to openings in a device enclosure; EMI shield contact rails, a central ground plane, a connector receptacle shield to provide isolation between the individual connector receptacles to reduce signal noise; and organizers and other structures arranged to reduce or eliminate damage to through-hole contact portions during their insertion into corresponding openings in a printed circuit board.
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