Invention Grant
- Patent Title: Method for manufacturing magnet-conductive device and glue-injectable punch structure thereof
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Application No.: US14200174Application Date: 2014-03-07
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Publication No.: US09780629B2Publication Date: 2017-10-03
- Inventor: Kuo-Yin Tu , Hsing-Chih Tsai , Hsin-Te Wang , Yi-Wei Sun
- Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
- Applicant Address: TW Kaohsiung
- Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
- Current Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
- Current Assignee Address: TW Kaohsiung
- Agency: Jackson IPG PLLC
- Agent Damian K. Jackson
- Priority: TW102110133A 20130321
- Main IPC: B29C65/72
- IPC: B29C65/72 ; H02K15/02

Abstract:
A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the inlet. The control member selectively obstructs the supply channel or permits the supply channel into conduction. By using the method for manufacturing the magnet-conductive device, the stack between plural plates is simplified, and the coupling strength between adjacent plates is enhanced. In addition, this invention considers the gel between adjacent plates to be insulating medium to lower the iron loss of the magnet-conductive plates.
Public/Granted literature
- US20140284837A1 METHOD FOR MANUFACTURING MAGNET-CONDUCTIVE DEVICE AND GLUE-INJECTABLE PUNCH STRUCTURE THEREOF Public/Granted day:2014-09-25
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