Invention Grant
- Patent Title: Semiconductor device and DC-to-DC converter
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Application No.: US14884566Application Date: 2015-10-15
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Publication No.: US09780659B2Publication Date: 2017-10-03
- Inventor: Hiroshi Saito , Ryo Wada , Yuichi Goto
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2009-295981 20091225
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H02M3/158 ; H01L23/495 ; H02M7/00 ; G05F1/46 ; H01L23/00 ; H02M3/156

Abstract:
In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.
Public/Granted literature
- US20160036331A1 SEMICONDUCTOR DEVICE AND DC-TO-DC CONVERTER Public/Granted day:2016-02-04
Information query
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