Invention Grant
- Patent Title: Method of making a microelectronic device
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Application No.: US15293859Application Date: 2016-10-14
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Publication No.: US09781833B2Publication Date: 2017-10-03
- Inventor: Messaoud Bedjaoui , Raphael Salot
- Applicant: Commissariat A L'Energie Atomique et aux Energies Alternatives
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1559794 20151015
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05K1/18 ; H01L51/52 ; H01L31/0203 ; H05K3/28 ; H05K1/11 ; H05K5/03 ; H05K5/00 ; H05K3/40

Abstract:
This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device; with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7). The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (21, 22), formant a tapping (81, 82) and in that the sealing seam (7) comprises a dielectric material.
Public/Granted literature
- US20170111994A1 METHOD OF MAKING A MICROELECTRONIC DEVICE Public/Granted day:2017-04-20
Information query
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