Method of making a microelectronic device
Abstract:
This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device; with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7). The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (21, 22), formant a tapping (81, 82) and in that the sealing seam (7) comprises a dielectric material.
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