Invention Grant
- Patent Title: Electronic module with cooling system for package-on-package devices
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Application No.: US14845845Application Date: 2015-09-04
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Publication No.: US09781863B1Publication Date: 2017-10-03
- Inventor: Daniel Kim
- Applicant: Microsemi Solutions (U.S.), Inc.
- Applicant Address: US CA Aliso Viejo
- Assignee: Microsemi Solutions (U.S.), Inc.
- Current Assignee: Microsemi Solutions (U.S.), Inc.
- Current Assignee Address: US CA Aliso Viejo
- Agent Dennis R. Haszko
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/367 ; H05K1/02 ; H01L25/065 ; H01L23/053 ; H05K3/30 ; H01L21/48
Abstract:
An apparatus for cooling a POP stacked package within a small form factor electronic module by configuring the enclosure of the module to come into direct contact with the device on the top surface in addition to the bottom surface to create two thermal conduction paths for the POP device to the enclosure. The enclosure itself then acts as the heat sink to draw heat from the device and into the surrounding air external to the optical module.
Information query
