A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. When the chip component is made to fall on the wire assembly, the chip component collides with the wire of any one of wire jigs.