A slurry and a coating method are provided. The slurry includes, by weight, between 10% and 40% metal powder, between 10% and 15% activator, between 10% and 20% adhesive, between 10% and 20% thickener, up to 30% ceramic, and up to 25% binder. The coating method includes providing a slurry including, by weight, between 10% and 40% metal powder, between 10% and 15% activator, between 10% and 20% adhesive, between 10% and 20% thickener, up to 30% ceramic, and up to 25% organic polymer binder, providing a substrate, applying the slurry over a surface of the substrate to form a slurry coating, drying the slurry coating over the substrate, baking the substrate and the slurry coating, and curing the slurry coating over the substrate. The curing the slurry coating over the substrate transfers metal elements of the metal powder in the slurry to the substrate to form a coating on the substrate.