- Patent Title: Process for electroless plating and a solution used for the same
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Application No.: US13661048Application Date: 2012-10-26
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Publication No.: US09783890B2Publication Date: 2017-10-10
- Inventor: Dennis Kwok-Wai Yee , Michael Chi-Yung Tang , Martin W. Bayes , Ka-Ming Yip , Chun-Man Chan , Hung-Tat Chan , Tsui-Kiu Li , Lok-Lok Liu
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Agent John Piskorski
- Main IPC: C23C18/30
- IPC: C23C18/30 ; C23C18/16 ; C23C18/18 ; C23C18/20 ; C23C18/38
Abstract:
A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
Public/Granted literature
- US20140120263A1 PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME Public/Granted day:2014-05-01
Information query
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