Invention Grant
- Patent Title: Heat insulator
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Application No.: US14755757Application Date: 2015-06-30
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Publication No.: US09784403B2Publication Date: 2017-10-10
- Inventor: Shuko Akamine , Mitsuhiro Fujita
- Applicant: Covalent Materials Corporation
- Applicant Address: JP Tokyo
- Assignee: COORSTEK KK
- Current Assignee: COORSTEK KK
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2014-137125 20140702; JP2014-138234 20140704; JP2014-141112 20140709; JP2014-154414 20140730; JP2014-234467 20141119; JP2014-249484 20141210; JP2014-258681 20141222
- Main IPC: C04B38/00
- IPC: C04B38/00 ; C04B38/06 ; F16L59/02 ; C04B35/44 ; C04B35/443 ; C04B35/80

Abstract:
One aspect of the heat insulator of the present invention includes a porous sintered body having a porosity of 70 vol % or more and less than 91 vol %, and pores having a pore size of 0.8 μm or more and less than 10 μm occupy 10 vol % or more and 70 vol % or less of the total pore volume, while pores having a pore size of 0.01 μm or more and less than 0.8 μm occupy 5 vol % or more and 30 vol % or less of the total pore volume. The porous sintered body is formed from an MgAl2O4 (spinel) raw material and fibers formed of an inorganic material, the heat conductivity of the heat insulator at 1000° C. or more and 1500° C. or less is 0.40 W/(m·K) or less, and the weight ratio of Si relative to Mg in the porous sintered body is 0.15 or less.
Public/Granted literature
- US20160003401A1 HEAT INSULATOR Public/Granted day:2016-01-07
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