Invention Grant
- Patent Title: Pattern verifying method
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Application No.: US14601250Application Date: 2015-01-21
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Publication No.: US09785046B2Publication Date: 2017-10-10
- Inventor: Te-Hsien Hsieh , Ming-Jui Chen , Cheng-Te Wang , Jing-Yi Lee , Jian-Yuan Ma , Yan-Chun Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201410673518 20141121
- Main IPC: G03F1/72
- IPC: G03F1/72 ; G03F1/84 ; G03F1/36 ; G03F1/70

Abstract:
The present invention provides a pattern verifying method. First, a target pattern is decomposed into a first pattern and a second pattern. A first OPC process is performed for the first pattern to form a first revised pattern, and a second OPC process is performed for the second pattern to form a second revised pattern. An inspection process is performed, wherein the inspection process comprises an after mask inspection (AMI) process, which comprises considering the target pattern, the first pattern and the second pattern.
Public/Granted literature
- US20160147140A1 PATTERN VERIFYING METHOD Public/Granted day:2016-05-26
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