- Patent Title: Cross-die interface snoop or global observation message ordering
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Application No.: US14582148Application Date: 2014-12-23
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Publication No.: US09785556B2Publication Date: 2017-10-10
- Inventor: Ramacharan Sundararaman , Tracey L. Gustafson , Robert J. Safranek
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: G06F12/08
- IPC: G06F12/08 ; G06F12/0831

Abstract:
Methods and apparatus relating to techniques for Cross-Die Interface (CDI) snoop and/or go (or completion) message ordering are described. In one embodiment, the order of a snoop message and a completion message are determined based at least on status of two bits. The snoop and completion messages are exchanged between a first integrated circuit die and a second integrated circuit die. The first integrated circuit die and the second integrated circuit die are coupled through a first interface and a second interface and the snoop message and the completion message are exchanged over at least one of the first interface and the second interface. Other embodiments are also disclosed.
Public/Granted literature
- US20160179673A1 CROSS-DIE INTERFACE SNOOP OR GLOBAL OBSERVATION MESSAGE ORDERING Public/Granted day:2016-06-23
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