- Patent Title: In-situ die-to-die impedance estimation for high-speed serial links
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Application No.: US14537011Application Date: 2014-11-10
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Publication No.: US09785607B2Publication Date: 2017-10-10
- Inventor: Bhavesh G. Patel , Bhyrav M. Mutnury
- Applicant: Dell Products, LP
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS, LP
- Current Assignee: DELL PRODUCTS, LP
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: G06F13/42
- IPC: G06F13/42 ; H04L25/03
Abstract:
A receiver includes an analog-to-digital converter (ADC) module that receives a test signal via a transmission channel and provides a time domain representation of the test signal as received by the receiver, and a processor that determines a time domain representation of an impedance of the transmission channel based on the time domain representation of the test signal.
Public/Granted literature
- US20160132459A1 In-Situ Die-to-Die Impedance Estimation for High-Speed Serial Links Public/Granted day:2016-05-12
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