Invention Grant
- Patent Title: Semiconductor package with sidewall-protected RDL interposer
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Application No.: US15296058Application Date: 2016-10-18
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Publication No.: US09786514B2Publication Date: 2017-10-10
- Inventor: Shing-Yih Shih , Tieh-Chiang Wu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01L25/18 ; H01L25/065
Abstract:
A semiconductor package includes a redistribution layer (RDL) interposer having a first side, a second side opposite to the first side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a molding compound disposed on the first side and covering the at least one semiconductor die and the vertical sidewall of the RDL interposer; and a plurality of solder bumps or solder balls mounted on the second side of the RDL interposer.
Public/Granted literature
- US20170263469A1 SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER Public/Granted day:2017-09-14
Information query
IPC分类:
