Invention Grant
- Patent Title: Power device having reduced thickness
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Application No.: US14946871Application Date: 2015-11-20
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Publication No.: US09786516B2Publication Date: 2017-10-10
- Inventor: Agatino Minotti , Cristiano Gianluca Stella
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Gardere Wynne Sewell LLP
- Priority: ITMI2011A1214 20110630
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L23/433 ; H01L23/495 ; H01L21/56 ; H01L23/367 ; H01L23/31
Abstract:
An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
Public/Granted literature
- US20160079092A1 POWER DEVICE HAVING REDUCED THICKNESS Public/Granted day:2016-03-17
Information query
IPC分类:
