Invention Grant
- Patent Title: Ablation method and recipe for wafer level underfill material patterning and removal
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Application No.: US14021938Application Date: 2013-09-09
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Publication No.: US09786517B2Publication Date: 2017-10-10
- Inventor: Rajendra C. Dias , Lars D. Skoglund , Anil R. Indluru , Edward R. Prack , Danish Faruqui , Tyler N. Osborn , Amram Eitan , Timothy A. Gosselin
- Applicant: Rajendra C. Dias , Lars D. Skoglund , Anil R. Indluru , Edward R. Prack , Danish Faruqui , Tyler N. Osborn , Amram Eitan , Timothy A. Gosselin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L21/48 ; H01L21/60 ; H01L23/31
Abstract:
Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.
Public/Granted literature
- US20150072479A1 ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTERNING AND REMOVAL Public/Granted day:2015-03-12
Information query
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