Invention Grant
- Patent Title: System and method for manufacturing a cavity down fabricated carrier
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Application No.: US14561499Application Date: 2014-12-05
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Publication No.: US09786518B2Publication Date: 2017-10-10
- Inventor: Ka Wa Cheung
- Applicant: Enablink Technologies Limited
- Applicant Address: HK Kowloon
- Assignee: ENABLINK TECHNOLOGIES LIMITED
- Current Assignee: ENABLINK TECHNOLOGIES LIMITED
- Current Assignee Address: HK Kowloon
- Agency: Keating and Bennett, LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L21/56 ; H01L23/00 ; H01L21/48 ; H01L23/13 ; H01L23/498
Abstract:
A method of fabricating a receptacle down BGA carrier having a top surface and a bottom surface, the method comprising combining a conductive portion and a molded dielectric portion, said dielectric portion having an inner surface intersecting said top surface, said inner surface forming a cavity for receiving a die; selectively etching part of said conductive portion; and applying solder resist to a portion of a top surface of said conductive portion.
Public/Granted literature
- US20150162218A1 SYSTEM AND METHOD FOR MANUFACTURING A CAVITY DOWN FABRICATED CARRIER Public/Granted day:2015-06-11
Information query
