A chip package method can include: forming bonding pins on a first region of a first surface of a carrier; forming an insulating layer on an inactive face of a chip, where the inactive face of the chip is opposite to an active face of the chip; pasting the chip on a second region of the first surface of the carrier by the insulating layer; electrically coupling electrodes on the active face of the chip to the bonding pins by conductive wires; forming an enclosure to cover the chip and the bonding pins by a molding process; and peeling away the carrier from the enclosure to expose the bonding pins and the insulating layer on a surface of the enclosure.