Invention Grant
- Patent Title: Apparatus for processing semiconductor wafers, in particular for carrying out a polymers removal process step
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Application No.: US14952076Application Date: 2015-11-25
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Publication No.: US09786525B2Publication Date: 2017-10-10
- Inventor: Dario Tenaglia , Sebastiano Cali
- Applicant: STMicroelectronics S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: ITM111A0646 20110415
- Main IPC: B08B3/02
- IPC: B08B3/02 ; H01L21/02 ; H01L21/67 ; B08B3/10 ; H01L21/306 ; H01L21/677
Abstract:
An apparatus for processing semiconductor wafers includes at least a wet bench and an automatic handling system of a wafer carrier removably connected thereto. The wet bench includes a first processing tank, a second processing tank and a third processing tank, separated from one another, each processing tank being dedicated to a different chemical, as well as a special cleaning and drying tank for processing the automatic handling system when the wafer carrier has been removed.
Public/Granted literature
Information query
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