Invention Grant
- Patent Title: Substrate supporting table, substrate processing apparatus, and manufacture method for semiconductor device
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Application No.: US13407091Application Date: 2012-02-28
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Publication No.: US09786528B2Publication Date: 2017-10-10
- Inventor: Masakazu Sakata
- Applicant: Masakazu Sakata
- Applicant Address: JP Tokyo
- Assignee: HITACHI KOKUSAI ELECTRIC INC.
- Current Assignee: HITACHI KOKUSAI ELECTRIC INC.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2011-48047 20110304
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/67 ; F28F1/12

Abstract:
The substrate supporting table includes a supporting plate that supports a substrate, a peripheral wall that encompasses a flow path of a coolant under the supporting plate and has an upper end enclosed by the supporting plate, a lower cover that encloses a bottom portion of the flow path and encloses a lower end of the peripheral wall. The substrate supporting table further includes a coolant supplying component that supplies a coolant through an upstream input of the flow path, a discharging component that discharges the coolant through a downstream output of the flow path, and a partition disposed between a supplying hole of the coolant supplying component and a discharging hole of the discharging component. A gap is formed between the partition and the bottom portion of the flow path.
Public/Granted literature
Information query
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