Invention Grant
- Patent Title: Wafer transfer method and system
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Application No.: US14518373Application Date: 2014-10-20
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Publication No.: US09786530B2Publication Date: 2017-10-10
- Inventor: Chien-Fa Lee , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/68
Abstract:
A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.
Public/Granted literature
- US20160111311A1 WAFER TRANSFER METHOD AND SYSTEM Public/Granted day:2016-04-21
Information query
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