Invention Grant
- Patent Title: Substrate processing apparatus and method of transferring a substrate
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Application No.: US14666196Application Date: 2015-03-23
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Publication No.: US09786532B2Publication Date: 2017-10-10
- Inventor: Toshio Yokoyama , Masahiko Sekimoto , Kenichi Kobayashi , Kenichi Akazawa , Takashi Mitsuya , Keiichi Kurashina
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2014-059565 20140324
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/687
Abstract:
A substrate processing apparatus is described herein. The substrate processing apparatus comprises a transferring device including: a grasping section configured to grasp a substrate holder, a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.
Public/Granted literature
- US20150270151A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANFSER METHOD Public/Granted day:2015-09-24
Information query
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