Invention Grant
- Patent Title: Dicing sheet with protective film forming layer and chip fabrication method
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Application No.: US14347667Application Date: 2012-09-27
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Publication No.: US09786541B2Publication Date: 2017-10-10
- Inventor: Tomonori Shinoda , Masaaki Furudate , Ken Takano
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Cahn & Samuels, LLP
- Priority: JP2011-217767 20110930; JP2011-217769 20110930
- International Application: PCT/JP2012/074923 WO 20120927
- International Announcement: WO2013/047674 WO 20130404
- Main IPC: B32B7/12
- IPC: B32B7/12 ; H01L21/683 ; H01L21/304 ; H01L21/78 ; C09J7/02 ; H01L23/544

Abstract:
A dicing sheet with a protective film forming layer has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130° C. or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130° C. for two hours is from −5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.
Public/Granted literature
- US20140295646A1 Dicing Sheet with Protective Film Forming Layer and Chip Fabrication Method Public/Granted day:2014-10-02
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