Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the semiconductor device
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Application No.: US12567084Application Date: 2009-09-25
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Publication No.: US09786565B2Publication Date: 2017-10-10
- Inventor: Hidenobu Fukutome , Hiroyuki Ohta , Mitsugu Tajima
- Applicant: Hidenobu Fukutome , Mitsugu Tajima
- Applicant Address: JP Yokohama
- Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8238 ; H01L21/28 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a transistor configuration including first and second gate electrodes, each of the first and second gate electrodes having at least a bottom layer and an upper layer including polycrystalline silicon grains, wherein the first gate electrode is a nMOS gate electrode formed in an nMOS region of the transistor configuration, wherein the polycrystalline silicon grains included in the bottom layer of the first gate electrode have a greater particle diameter than the polycrystalline grains included in the upper layer of the second gate electrode.
Public/Granted literature
- US20100078729A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2010-04-01
Information query
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