- Patent Title: Planar leadframe substrate having a downset below within a die area
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Application No.: US15010938Application Date: 2016-01-29
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Publication No.: US09786582B2Publication Date: 2017-10-10
- Inventor: Chia-Yu Chang , Bob Lee , Steven Su
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L23/31 ; H05K1/11
Abstract:
A leadframe for encasing in a mold material includes a plurality of interconnected support members. A die pad is connected to the support members and includes a bottom surface. The die pad is configured to receive a die. A downset is connected to the die pad and positioned below the bottom surface. The downset includes at least one wall defining an interior volume for receiving a flow of the mold material to reduce the velocity of the mold material flow through the downset.
Public/Granted literature
- US20170221799A1 PLANAR LEADFRAME SUBSTRATE HAVING A DOWNSET BELOW WITHIN A DIE AREA Public/Granted day:2017-08-03
Information query
IPC分类:
