Invention Grant
- Patent Title: Lead-frame
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Application No.: US14691100Application Date: 2015-04-20
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Publication No.: US09786585B2Publication Date: 2017-10-10
- Inventor: Pieter Offeringa
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/3205 ; H01L21/48

Abstract:
One example discloses a lead-frame, comprising: a die-pad having a die coupling surface; a set of terminals each having an outer terminal edge and an inner terminal edge; wherein the outer terminal edge faces away from the die-pad and the inner terminal edge faces toward the die-pad; and a terminal connector having a first side coupled to the inner terminal edge and a second side coupled to the die-pad.
Public/Granted literature
- US20160307825A1 LEAD-FRAME Public/Granted day:2016-10-20
Information query
IPC分类: