Invention Grant
- Patent Title: Semiconductor package including a conductive fabric
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Application No.: US15070184Application Date: 2016-03-15
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Publication No.: US09786590B2Publication Date: 2017-10-10
- Inventor: In Chul Hwang , Ki Young Kim , Myung Geun Park
- Applicant: SK Hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2015-0184172 20151222
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498 ; H01L23/00 ; H05K1/11
Abstract:
A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.
Public/Granted literature
- US20170179003A1 SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE FABRIC Public/Granted day:2017-06-22
Information query
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