Invention Grant
- Patent Title: Semiconductor package
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Application No.: US15222155Application Date: 2016-07-28
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Publication No.: US09786624B2Publication Date: 2017-10-10
- Inventor: Jae-chan Lee , Chang-yong Park , Hun Han , Jae-hoon Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP.
- Priority: KR10-2015-0131536 20150917
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L21/56 ; H01L23/00
Abstract:
A semiconductor package includes a substrate having a groove in an upper surface. A semiconductor device is mounted on the substrate to cover one portion of the groove and leaving another portion exposed.
Public/Granted literature
- US20170084511A1 SEMICONDUCTOR PACKAGE Public/Granted day:2017-03-23
Information query
IPC分类:
