Invention Grant
- Patent Title: Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
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Application No.: US14846010Application Date: 2015-09-04
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Publication No.: US09786626B2Publication Date: 2017-10-10
- Inventor: Agatino Minotti , Gaetano Montalto
- Applicant: STMicroelectronics S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group LLP
- Priority: ITTO2014A0975 20141126
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L25/00 ; H01L23/00
Abstract:
An electronic device includes: a semiconductor body; a front metallization region; a top buffer region, arranged between the front metallization region and the semiconductor body; and a conductive wire, electrically connected to the front metallization region. The top buffer region is at least partially sintered.
Public/Granted literature
- US20160148896A1 SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND MANUFACTURING PROCESS THEREOF Public/Granted day:2016-05-26
Information query
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