Invention Grant
- Patent Title: Air trench in packages incorporating hybrid bonding
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Application No.: US15356887Application Date: 2016-11-21
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Publication No.: US09786628B2Publication Date: 2017-10-10
- Inventor: Bruce C. S. Chou , Chen-Jong Wang , Ping-Yin Liu , Jung-Kuo Tu , Tsung-Te Chou , Xin-Hua Huang , Hsun-Chung Kuang , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/522 ; H01L21/308 ; H01L21/764 ; H01L25/00 ; H01L25/065 ; H01L23/532
Abstract:
A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
Public/Granted literature
- US20170069593A1 Air Trench in Packages Incorporating Hybrid Bonding Public/Granted day:2017-03-09
Information query
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