Invention Grant
- Patent Title: Interconnection structures and methods for making the same
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Application No.: US14802903Application Date: 2015-07-17
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Publication No.: US09786634B2Publication Date: 2017-10-10
- Inventor: Cheng-Heng Kao , Han-Tang Hung , Chun-Hsiang Yang , Yan-Bin Chen
- Applicant: NATIONAL TAIWAN UNIVERSITY
- Applicant Address: TW Taipei
- Assignee: NATIONAL TAIWAN UNIVERSITY
- Current Assignee: NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Taipei
- Agency: Perkins Coie LLP
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L25/065 ; H01L25/00
Abstract:
The present disclosure provides a method for interconnecting components. First and second substrates are provided. First and second components are respectively provided on the first and second substrates, in which the second component is not in contact with the first component. Then, a joint component is formed between the first and second components by passing a flow of a fluid comprising ions of a conductive material between the first and second components and electrolessly plating the first and second components by the conductive material so that the joint component is electrically connected between the first and second components. The present disclosure also provides related interconnection structures and a fixture for forming a related microchannel structure.
Public/Granted literature
- US20170018532A1 INTERCONNECTION STRUCTURES AND METHODS FOR MAKING THE SAME Public/Granted day:2017-01-19
Information query
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