This nonvolatile semiconductor memory device includes: a memory cell array including a memory cell; a wiring part connecting the memory cell array to an external circuit; and a transistor that connects the wiring part and the external circuit, the transistor including: a first insulating layer including a first region, a second region, and a third region, the second and third regions being disposed on both sides of the first region, and a height of an upper surface of the first region being lower than those of the second region and the third region; a semiconductor layer disposed along upper surfaces of the first region, the second region, and the third region; and a gate electrode layer disposed via the semiconductor layer and a gate insulating film, on an upper part of the second region.