Invention Grant
- Patent Title: Moisture barrier capacitors in semiconductor components
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Application No.: US14670030Application Date: 2015-03-26
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Publication No.: US09786733B2Publication Date: 2017-10-10
- Inventor: Hans-Joachim Barth , Helmut Horst Tews
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L49/02 ; H01L23/522 ; H01L23/00 ; H01L23/58 ; H01L27/06 ; H01L27/08 ; G06F17/50 ; H01L21/768 ; H01L21/66
Abstract:
Structures and methods of forming moisture barrier capacitor on a semiconductor component are disclosed. The capacitor is located on the periphery of a semiconductor chip and includes an inner plate electrically connected to a voltage node, an outer plate with fins for electrically connecting to a different voltage node.
Public/Granted literature
- US20150200244A1 Moisture Barrier Capacitors in Semiconductor Components Public/Granted day:2015-07-16
Information query
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