Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US14177820Application Date: 2014-02-11
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Publication No.: US09786752B2Publication Date: 2017-10-10
- Inventor: Chikara Terada
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2013-057308 20130319; JP2013-057309 20130319
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/762 ; H01L27/11546 ; H01L29/788 ; H01L21/8238 ; H01L27/092

Abstract:
A semiconductor device of the present invention is a semiconductor device selectively including a nonvolatile memory cell on a semiconductor substrate, and includes a trench formed in the semiconductor substrate, an element separation portion buried into the trench such that the element separation portion has a projecting part projecting from the semiconductor substrate, the element separation portion defining an active region in first a region for the nonvolatile memory cell of the semiconductor substrate, and a floating gate disposed in the active region such that the floating gate selectively has an overlapping part overlapping the element separation portion, and the floating gate has a shape recessed with respect to the overlapping part.
Public/Granted literature
- US20140284681A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-09-25
Information query
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