Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US15249724Application Date: 2016-08-29
-
Publication No.: US09786778B1Publication Date: 2017-10-10
- Inventor: Kohei Morizuka
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Priority: JP2016-107752 20160530
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L29/10 ; H01L29/06 ; H01L27/088

Abstract:
A semiconductor device including a first electrode, a second electrode, and a silicon carbide layer of which at least a portion is provided between the first electrode and the second electrode, the silicon carbide layer including an n-type first silicon carbide region, a plurality of p-type second silicon carbide regions, and a plurality of n-type third silicon carbide regions. The semiconductor device further includes a plurality of first conductive layers each of which is in contact with the n-type first silicon carbide region, a number n, n being 2, 3, 4 or 5, of first gate electrodes that are provided between two adjacent first conductive layers of the plurality of first conductive layers, and extend in the first direction, and a plurality of first gate insulating layers each of which is provided between one of the n first gate electrodes and the n-type first silicon carbide region.
Information query
IPC分类: