Invention Grant
- Patent Title: Non-planar quantum well device having interfacial layer and method of forming same
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Application No.: US15345546Application Date: 2016-11-08
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Publication No.: US09786786B2Publication Date: 2017-10-10
- Inventor: Willy Rachmady , Ravi Pillarisetty , Van H. Le , Robert S. Chau
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L29/78 ; B82Y10/00 ; H01L29/66 ; H01L29/775 ; H01L29/267 ; H01L29/165 ; H01L29/10 ; H01L29/15 ; H01L21/306 ; H01L21/762 ; H01L29/06 ; H01L29/12 ; H01L29/51

Abstract:
Techniques are disclosed for forming a non-planar quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), and a quantum well layer. A fin structure is formed in the quantum well structure, and an interfacial layer provided over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.
Public/Granted literature
- US20170054026A1 Non-Planar Quantum Well Device Having Interfacial Layer and Method of Forming Same Public/Granted day:2017-02-23
Information query
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