Invention Grant
- Patent Title: Method of fabricating memory structure
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Application No.: US15096044Application Date: 2016-04-11
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Publication No.: US09786794B2Publication Date: 2017-10-10
- Inventor: Cheng-Hsien Cheng , Wen-Jer Tsai , Shih-Guei Yan , Chih-Chieh Cheng , Jyun-Siang Huang
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L21/28 ; H01L29/423 ; H01L29/66 ; H01L29/792 ; H01L27/11551 ; H01L27/11578

Abstract:
A memory structure includes a memory cell, and the memory cell includes following elements. A first gate is disposed on a substrate. A stacked structure includes a first dielectric structure, a channel layer, a second dielectric structure and a second gate disposed on the first gate, a first charge storage structure disposed in the first dielectric structure and a second charge storage structure disposed in the second dielectric structure. The first charge storage structure is a singular charge storage unit and the second charge storage structure comprises two charge storage units which are physically separated. A channel output line physically connected to the channel layer. A first dielectric layer is disposed on the first gate at two sides of the stacked structure. A first source or drain and a second source or drain are disposed on the first dielectric layer and located at two sides of the channel layer.
Public/Granted literature
- US20160225911A1 METHOD OF FABRICATING MEMORY STRUCTURE Public/Granted day:2016-08-04
Information query
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