Invention Grant
- Patent Title: Method for producing an optoelectronic component
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Application No.: US14769198Application Date: 2014-01-15
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Publication No.: US09786824B2Publication Date: 2017-10-10
- Inventor: Stefan Illek , Hans-Jürgen Lugauer , Jürgen Moosburger , Thomas Schwarz , Tansen Varghese
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102013202906 20130222
- International Application: PCT/EP2014/050700 WO 20140115
- International Announcement: WO2014/127933 WO 20140828
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/00 ; H01L33/50 ; H01L33/62
Abstract:
A method can be used for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. A sacrificial layer is applied to the rear face. A molded body is formed the optoelectronic semiconductor chip being at least partially embedded in the molded body. The sacrificial layer is removed.
Public/Granted literature
- US20160005936A1 Method for Producing an Optoelectronic Component Public/Granted day:2016-01-07
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