Invention Grant
- Patent Title: Thermocouple device
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Application No.: US13051748Application Date: 2011-03-18
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Publication No.: US09786829B2Publication Date: 2017-10-10
- Inventor: William J. Grande , Lori J. Shaw-Klein , Li Min
- Applicant: William J. Grande , Lori J. Shaw-Klein , Li Min
- Applicant Address: US NY Honeoye Falls
- Assignee: Micropen Technologies Corporation
- Current Assignee: Micropen Technologies Corporation
- Current Assignee Address: US NY Honeoye Falls
- Agency: LeClairRyan, a Professional Corporation
- Main IPC: H01L35/02
- IPC: H01L35/02 ; H01L35/34 ; B41F33/00 ; H01L35/32 ; G01K7/02 ; G01K13/00 ; A61B18/14 ; A61B18/00 ; A61B90/00

Abstract:
In one aspect, the present invention relates to a thermocouple device comprising a flexible non-planar substrate, a first printed thermocouple element comprising a first metal containing ink composition applied to the flexible non-planar substrate, and a second printed thermocouple element in electrical contact with the first printed thermocouple element making a thermocouple junction. The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect. The present application further relates to medical devices comprising the thermocouple and methods of making such devices.
Public/Granted literature
- US20110277803A1 THERMOCOUPLE DEVICE Public/Granted day:2011-11-17
Information query
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