Invention Grant
- Patent Title: Packages for integrated circuits and methods of packaging integrated circuits
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Application No.: US15290849Application Date: 2016-10-11
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Publication No.: US09786838B2Publication Date: 2017-10-10
- Inventor: Angelo V. Ugge
- Applicant: Everspin Technologies, Inc.
- Applicant Address: US AZ Chandler
- Assignee: Everspin Technologies, Inc.
- Current Assignee: Everspin Technologies, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Bookoff McAndrews, PLLC
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L27/22 ; H01L43/08 ; H01L43/12
Abstract:
An integrated circuit package including an integrated circuit die including a first side and a second side opposite the first side, the first side including at least one magnetoresistive device formed thereon. The integrated circuit package also may include a first magnetic shield disposed on or adjacent the first side of the integrated circuit die, wherein the first magnetic shield is formed of a composite material.
Public/Granted literature
- US20170104149A1 PACKAGES FOR INTEGRATED CIRCUITS AND METHODS OF PACKAGING INTEGRATED CIRCUITS Public/Granted day:2017-04-13
Information query
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