Invention Grant
- Patent Title: Card connector system with heat dissipation and electromagnetic interference (EMI) shielding
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Application No.: US14934580Application Date: 2015-11-06
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Publication No.: US09787033B2Publication Date: 2017-10-10
- Inventor: Jonathan Randall Hinkle , Yasushi Honda , Shiro Konaka , Jason A. Matteson , Shigefumi Odaohhara
- Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Zilka-Kotab, P.C.
- Main IPC: H01R13/6581
- IPC: H01R13/6581 ; H01R12/72

Abstract:
A system according to one embodiment includes opposing slide plates, and opposing guide blocks configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. A system according to another embodiment includes opposing slide plates and a thermal interface material coupled to opposing inner faces of the slide plate. Opposing guide blocks are configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. An interface connector is coupled to at least one of the guide blocks and the slide plates, the interface connector having electrical connectors on opposite ends thereof.
Public/Granted literature
- US20170133794A1 CARD CONNECTOR SYSTEM WITH HEAT DISSIPATION AND ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING Public/Granted day:2017-05-11
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