- Patent Title: Stacked modular architecture high-resolution thermal chip camera
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Application No.: US14845861Application Date: 2015-09-04
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Publication No.: US09787914B2Publication Date: 2017-10-10
- Inventor: Louise C Sengupta , Pierre-Alain S Auroux , Evan A Binkerd , Richard J Blackwell, Jr. , Mihir D Boal , Jeffrey F Bryant , Don A Harris , Donald D McManus
- Applicant: BAE Systems Information and Electronic Systems Integration Inc.
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Maine Cernota & Rardin
- Main IPC: H04N5/33
- IPC: H04N5/33 ; H01L27/146 ; H01L27/108 ; H01L27/11517 ; H01L27/11563 ; H04N5/225
Abstract:
An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.
Public/Granted literature
- US20170070685A1 STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA Public/Granted day:2017-03-09
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