Invention Grant
- Patent Title: Circuit board and method of manufacturing the same
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Application No.: US15074209Application Date: 2016-03-18
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Publication No.: US09788433B2Publication Date: 2017-10-10
- Inventor: Doo Hwan Lee , Yul Kyo Chung , Yee Na Shin , Seung Eun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0158340 20121231
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/03 ; H05K3/00 ; H05K1/02 ; H05K1/11 ; H05K3/46 ; H01L23/00
Abstract:
A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer.
Public/Granted literature
- US20160205773A1 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-07-14
Information query
