A composite substrate sensor device comprises: a first substrate sensing chip having an upper surface, a lower surface, side surfaces and scanning and receiving circuit cells; a second substrate connected to the first substrate sensing chip; an insulating layer set comprising insulating layers and disposed on upper surfaces of the second substrate and the first substrate sensing chip on a virtual common plane; scanning and receiving electrode cells disposed on an upper surface of the insulating layer set on a physical common plane substantially parallel to the virtual common plane; and scanning and receiving wires formed on the insulating layer set and electrically connecting the scanning and receiving electrode cells to the scanning and receiving circuit cells, respectively, so that the receiving circuit cells sense an electric field variation of an object through the receiving electrode cells and receiving wires. A method of manufacturing the sensor device is also provided.