Invention Grant
- Patent Title: Systems and methods for coupling electrically isolated sections of an electronic device
-
Application No.: US14810501Application Date: 2015-07-28
-
Publication No.: US09788443B2Publication Date: 2017-10-10
- Inventor: Daniel William Jarvis
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/00 ; G06F1/16 ; H04M1/02

Abstract:
Each knuckle is molded in and/or around a coupling structure that is either welded to or is an integral part of the section. The coupling structure can be a bracket that is welded to an inner surface of a section, and the bracket is constructed to have a cross-section that minimizes capacitance. In one embodiment, a first bracket can be welded to a first conductive section, and a second bracket can be welded to a second conductive section. A knuckle constructed from an insulating material that is overmolded within and around the first and second brackets such that the first and second conductive sections are coupled together. The first and second conductive sections and their respective brackets are spaced a predetermined distanced apart, thereby ensuring the conductive sections are electrically isolated.
Public/Granted literature
- US20150334860A1 SYSTEMS AND METHODS FOR COUPLING ELECTRICALLY ISOLATED SECTIONS OF AN ELECTRONIC DEVICE Public/Granted day:2015-11-19
Information query