- Patent Title: Thermal stand-off with tortuous solid-wall thermal conduction path
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Application No.: US14219041Application Date: 2014-03-19
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Publication No.: US09788459B2Publication Date: 2017-10-10
- Inventor: Kevin Mark Noonan
- Applicant: Aerojet Rocketdyne, Inc.
- Applicant Address: US CA Rancho Cordova
- Assignee: AEROJET ROCKETDYNE, INC.
- Current Assignee: AEROJET ROCKETDYNE, INC.
- Current Assignee Address: US CA Rancho Cordova
- Agent Joel G Landau
- Main IPC: F28F13/00
- IPC: F28F13/00 ; H05K7/20

Abstract:
A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.
Public/Granted literature
- US20150271955A1 THERMAL STAND-OFF WITH TORTUOUS SOLID-WALL THERMAL CONDUCTION PATH Public/Granted day:2015-09-24
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