- Patent Title: Heatsink providing equivalent cooling for multiple in-line modules
-
Application No.: US14956440Application Date: 2015-12-02
-
Publication No.: US09788460B2Publication Date: 2017-10-10
- Inventor: David Barron , Ethan E. Cruz , Howard V. Mahaney, Jr. , Phillip V. Mann , Matthew T. Richardson
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Law Office of Jim Boice
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; G06F1/20

Abstract:
A heatsink structure cools a first electronic chip and a second electronic chip that are positioned serially and in-line to one or more cooling fan, such that cooling air from the cooling fan(s) passes above the first electronic chip before passing above the second electronic chip. The heatsink structure includes a first heatsink and a second heatsink, which are identical to each other, and which fit adjacent to one another when a first heatsink is rotated 180 degrees relative to the second heatsink.
Public/Granted literature
- US20170164520A1 Heatsink providing equivalent cooling for multiple in-line modules Public/Granted day:2017-06-08
Information query