Invention Grant
- Patent Title: Magnet placement for integrated sensor packages
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Application No.: US14141759Application Date: 2013-12-27
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Publication No.: US09791470B2Publication Date: 2017-10-17
- Inventor: Feras Eid , Sasha N. Oster , Kyu Oh Lee , Sarah Haney
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Scwabe, Williamson & Wyatt P.C.
- Main IPC: H01L27/22
- IPC: H01L27/22 ; G01P1/04 ; G01P15/097 ; B81C1/00 ; B81B3/00 ; B81B7/00
Abstract:
Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.
Public/Granted literature
- US20150185247A1 MAGNET PLACEMENT FOR INTEGRATED SENSOR PACKAGES Public/Granted day:2015-07-02
Information query
IPC分类:
