Invention Grant
- Patent Title: Semiconductor module having a tab pin with no tie bar
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Application No.: US14625983Application Date: 2015-02-19
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Publication No.: US09793034B2Publication Date: 2017-10-17
- Inventor: Jong-hyun Seok
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2014-0077492 20140624
- Main IPC: H01C13/02
- IPC: H01C13/02 ; G11C5/04 ; H05K1/11 ; G11C11/401 ; G11C7/10 ; H05K3/34
Abstract:
A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.
Public/Granted literature
- US20150373848A1 SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR Public/Granted day:2015-12-24
Information query
