Invention Grant
- Patent Title: Use of vacuum chucks to hold a wafer or wafer sub-stack
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Application No.: US14408890Application Date: 2013-06-28
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Publication No.: US09793152B2Publication Date: 2017-10-17
- Inventor: Hartmut Rudmann , Stephan Heimgartner , John A. Vidallon
- Applicant: Heptagon Micro Optics Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Heptagon Micro Optics Pte. Ltd.
- Current Assignee: Heptagon Micro Optics Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Fish & Richardson P.C.
- International Application: PCT/SG2013/000269 WO 20130628
- International Announcement: WO2014/007758 WO 20140109
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; B32B37/18 ; B32B37/12 ; B32B38/18
Abstract:
Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
Public/Granted literature
- US20150340265A1 Use of Vacuum Chucks to Hold a Wafer or Wafer Sub-Stack Public/Granted day:2015-11-26
Information query
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